A ball grid array (BGA) is a surface-mount packaging (a chip carrier) used for integrated circuits. Engineers use BGA packages to mount devices such as microprocessors permanently onto a PCB.
A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.
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ADVANTAGES OF USING BALL GRID ARRAY (BGA)
- A reliable high density of pins.
- Better heat conduction.
- Low inductance leads for superior electrical performance.
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DISADVANTAGES OF USING BALL GRID ARRAY (BGA)
- Lack of flexibility in the solder balls.
- It’s challenging to inspect and find out whether soldering was done right.
- BGAs are not practical during circuit development.
- Soldering BGA is expensive.
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