|CAD Computer-Aided Design
|Computer technology used to design a product.
|CAE Computer-Aided Engineering
|Refers to the broad usage of computer software to aid in engineering analysis tasks.
|CAF Conductive Anodic Filament
|Metallic filament that forms from an electrochemical migration process and causes failures on printed circuit boards.
|Conductive Anodic Filament
|CAM Computer-Aided Manufacturing
|Refers to the use of software to control machine tools in the manufacturing of workpieces
|CAPDS Capability Detail Specification
|A document that establishes the specific requirements, noted in a detailed specification, to develop the level of capability that a manufacturer possesses when he has demonstrated that he has met those requirements.
|Capability Detail Specification
|CBGA/CCGA – Ceramic Ball Grid Array/Ceramic Column Grid Array
|A grid array packaged component that has ceramic as the substrate of the package and may have either solder balls or solder columns for connections.
|Ceramic Ball Grid Array/Ceramic Column Grid Array
|CDS Customer Detail Specification
|A document that describes the requirements of a desired system from the customer’s or user’s point of view.
|Customer Detail Specification
|CEM Contract Electronics Manufacturing
|Production of electronic equipment on behalf of an original equipment manufacturer (OEM) customer, in which the design and brand name belongs to the OEM.
|Contract Electronics Manufacturing
|CFT Customer Focus Team
|A team dedicated to the customer under the leadership of a program manager.
|Customer Focus Team
|CNC Computer Numerical Control
|Automated control of machining tools and 3D printers using a computer.
|Computer Numerical Control
|COB Chip On Board
|Manufacturing process where integrated circuits are wired and bonded directly to a printed circuit board.
|Chip On Board
|CP Capability Performance Index
|The ratio of the measured performance of a process compared to specified limits.
|Capability Performance Index
|CSP Chip Scale Package
|A chip scale package is a type of integrated circuit package.
|Chip Scale Package
|CTB Capability Test Board
|A printed board specially designed to act as a capability-qualifying component (CQC) or to be used by the manufacturer to evaluate process variation, process control, or continuous improvement procedures.
|Capability Test Board
|CTE Coefficient of Thermal Expansion
|This describes how the size of an object changes with a change in temperature.
|Coefficient of Thermal Expansion
|CTO Configure-to-Order Systems Assembly
|Hybrid of make to stock and make to order operations.
|Configure-to-Order Systems Assembly
|CTP Composite Test Pattern
|A grouping of individual test patterns into specific arrangements, to reflect control and precision capability of a manufacturer or manufacturing process.
|Composite Test Pattern
|CTS Capability Test Segment
|A segment or portion of a capability test board (CTB), containing a set or group of individual test patterns (ITP), intended to be used to demonstrate a specific level of printed board complexity or manufacturing capability.
|Capability Test Segment
|Control chart used to monitor small shifts in the process mean. It uses the cumulative sum of deviations from a target.
|Cumulative Sum Control Chart
|CAPA Corrective and Preventative Action
|Improvements in processes to eliminate causes of non-conformities or other undesirable situations.
|Corrective and Preventative Action