CAD Computer-Aided Design |
Computer technology used to design a product. |
Computer-Aided Design |
CAE Computer-Aided Engineering |
Refers to the broad usage of computer software to aid in engineering analysis tasks. |
Computer-Aided Engineering |
CAF Conductive Anodic Filament |
Metallic filament that forms from an electrochemical migration process and causes failures on printed circuit boards. |
Conductive Anodic Filament |
CAM Computer-Aided Manufacturing |
Refers to the use of software to control machine tools in the manufacturing of workpieces |
Computer-Aided Manufacturing |
CAPDS Capability Detail Specification |
A document that establishes the specific requirements, noted in a detailed specification, to develop the level of capability that a manufacturer possesses when he has demonstrated that he has met those requirements. |
Capability Detail Specification |
CBGA/CCGA – Ceramic Ball Grid Array/Ceramic Column Grid Array |
A grid array packaged component that has ceramic as the substrate of the package and may have either solder balls or solder columns for connections. |
Ceramic Ball Grid Array/Ceramic Column Grid Array |
CDS Customer Detail Specification |
A document that describes the requirements of a desired system from the customer’s or user’s point of view. |
Customer Detail Specification |
CEM Contract Electronics Manufacturing |
Production of electronic equipment on behalf of an original equipment manufacturer (OEM) customer, in which the design and brand name belongs to the OEM. |
Contract Electronics Manufacturing |
CFT Customer Focus Team |
A team dedicated to the customer under the leadership of a program manager. |
Customer Focus Team |
CNC Computer Numerical Control |
Automated control of machining tools and 3D printers using a computer. |
Computer Numerical Control |
COB Chip On Board |
Manufacturing process where integrated circuits are wired and bonded directly to a printed circuit board. |
Chip On Board |
CP Capability Performance Index |
The ratio of the measured performance of a process compared to specified limits. |
Capability Performance Index |
CSP Chip Scale Package |
A chip scale package is a type of integrated circuit package. |
Chip Scale Package |
CTB Capability Test Board |
A printed board specially designed to act as a capability-qualifying component (CQC) or to be used by the manufacturer to evaluate process variation, process control, or continuous improvement procedures. |
Capability Test Board |
CTE Coefficient of Thermal Expansion |
This describes how the size of an object changes with a change in temperature. |
Coefficient of Thermal Expansion |
CTO Configure-to-Order Systems Assembly |
Hybrid of make to stock and make to order operations. |
Configure-to-Order Systems Assembly |
CTP Composite Test Pattern |
A grouping of individual test patterns into specific arrangements, to reflect control and precision capability of a manufacturer or manufacturing process. |
Composite Test Pattern |
CTS Capability Test Segment |
A segment or portion of a capability test board (CTB), containing a set or group of individual test patterns (ITP), intended to be used to demonstrate a specific level of printed board complexity or manufacturing capability. |
Capability Test Segment |
CUSUM CHART |
Control chart used to monitor small shifts in the process mean. It uses the cumulative sum of deviations from a target. |
Cumulative Sum Control Chart |
CAPA Corrective and Preventative Action |
Improvements in processes to eliminate causes of non-conformities or other undesirable situations. |
Corrective and Preventative Action |