|CAD Computer-Aided Design
||Computer technology used to design a product.
|CAE Computer-Aided Engineering
||Refers to the broad usage of computer software to aid in engineering analysis tasks.
|CAF Conductive Anodic Filament
||Metallic filament that forms from an electrochemical migration process and causes failures on printed circuit boards.
||Conductive Anodic Filament
|CAM Computer-Aided Manufacturing
||Refers to the use of software to control machine tools in the manufacturing of workpieces
|CAPDS Capability Detail Specification
||A document that establishes the specific requirements, noted in a detailed specification, to develop the level of capability that a manufacturer possesses when he has demonstrated that he has met those requirements.
||Capability Detail Specification
|CBGA/CCGA – Ceramic Ball Grid Array/Ceramic Column Grid Array
||A grid array packaged component that has ceramic as the substrate of the package and may have either solder balls or solder columns for connections.
||Ceramic Ball Grid Array/Ceramic Column Grid Array
|CDS Customer Detail Specification
||A document that describes the requirements of a desired system from the customer’s or user’s point of view.
||Customer Detail Specification
|CEM Contract Electronics Manufacturing
||Production of electronic equipment on behalf of an original equipment manufacturer (OEM) customer, in which the design and brand name belongs to the OEM.
||Contract Electronics Manufacturing
|CFT Customer Focus Team
||A team dedicated to the customer under the leadership of a program manager.
||Customer Focus Team
|CNC Computer Numerical Control
||Automated control of machining tools and 3D printers using a computer.
||Computer Numerical Control
|COB Chip On Board
||Manufacturing process where integrated circuits are wired and bonded directly to a printed circuit board.
||Chip On Board
|CP Capability Performance Index
||The ratio of the measured performance of a process compared to specified limits.
||Capability Performance Index
|CSP Chip Scale Package
||A chip scale package is a type of integrated circuit package.
||Chip Scale Package
|CTB Capability Test Board
||A printed board specially designed to act as a capability-qualifying component (CQC) or to be used by the manufacturer to evaluate process variation, process control, or continuous improvement procedures.
||Capability Test Board
|CTE Coefficient of Thermal Expansion
||This describes how the size of an object changes with a change in temperature.
||Coefficient of Thermal Expansion
|CTO Configure-to-Order Systems Assembly
||Hybrid of make to stock and make to order operations.
||Configure-to-Order Systems Assembly
|CTP Composite Test Pattern
||A grouping of individual test patterns into specific arrangements, to reflect control and precision capability of a manufacturer or manufacturing process.
||Composite Test Pattern
|CTS Capability Test Segment
||A segment or portion of a capability test board (CTB), containing a set or group of individual test patterns (ITP), intended to be used to demonstrate a specific level of printed board complexity or manufacturing capability.
||Capability Test Segment
||Control chart used to monitor small shifts in the process mean. It uses the cumulative sum of deviations from a target.
||Cumulative Sum Control Chart
|CAPA Corrective and Preventative Action
||Improvements in processes to eliminate causes of non-conformities or other undesirable situations.
||Corrective and Preventative Action