Manufacturing terms, every industry has its abbreviations, but in the electronics field, they seem to be especially common.
An additional problem is that even when you know which words the letters OEM stand for, it still may not be clear what the actual meaning is.
Below we have made a list of the most common electronic manufacturing acronyms and design terms, we hope it helps!
LIST OF DESIGN AND MANUFACTURING TERMS
A
WHAT DOES AC MEAN IN ELECTRONICS?
It means Alternating Current. An electric current that periodically reverses direction, in contrast to direct current which flows only in one direction.
WHAT DOES ANOVA MEAN IN MANUFACTURING?
It means Analysis of Variance. A statistical model used to analyze the differences among group means in a sample.
WHAT DOES AOI MEAN IN ELECTRONICS?
It means Automated Optical Inspection. Automated visual inspection for printed circuit boards where a camera scans the PCB for both catastrophic failure and quality defects.
WHAT DOES AQL MEAN IN MANUFACTURING?
It means Acceptance Quality Level. A measure applied to products and defined in ISO 2859-1 as the “quality level that is the worst tolerable.”
WHAT DOES ATE MEAN IN ELECTRONICS?
It means Automatic Test Equipment. Any apparatus that performs tests on a device using automation to quickly perform measurements and evaluate the test results.
WHAT DOES ATG MEAN IN ELECTRONICS?
It means Automatic Test Generation. Computer generation of a test program based solely on circuit technology, requiring little or no manual programming effort.
WHAT DOES AVL MEAN IN MANUFACTURING?
It means Approved Vendor List. A listing of various types of suppliers and providers that a company has agreed meets its standards in terms of quality and price.
WHAT DOES AML MEAN IN MANUFACTURING?
It means Approved Manufacturer List. A list of manufacturers approved to manufacture the materials specified in the bill of materials for a product.
B
| Acronyms | Meaning | Explanation |
| BGA Meaning in Electronics | Ball Grid Array | A type of surface-mount packaging used for integrated circuits. |
| BOM Meaning in Manufacturing | Bill of Materials | A list of the raw materials, sub-assemblies, intermediate assemblies, sub-components, parts, and the quantities of each needed to manufacture an end product |
| BS Meaning in Manufacturing | Basic Specification | A document that describes the common elements for a set, family, or group of products, materials, or services. |
| BTO Meaning in Manufacturing | Build-To-Order Systems Assembly | Building and testing of a complete product to specific customer order, including required peripherals, software, and documentation. |
C
| Acronyms | Meaning | Explanation |
| CAD Meaning in Electronics | Computer-Aided Design | Computer technology used to design a product. |
| CAE Meaning in Electronics | Computer-Aided Engineering | Refers to the broad usage of computer software to aid in engineering analysis tasks. |
| CAF Meaning in Electronics | Conductive Anodic Filament | Metallic filament that forms from an electrochemical migration process and causes failures on printed circuit boards. |
| CAM Meaning in Manufacturing | Computer-Aided Manufacturing | Refers to the use of software to control machine tools in the manufacturing of workpieces |
| CAPDS Meaning in Manufacturing | Capability Detail Specification | A document that establishes the specific requirements, noted in a detailed specification, to develop the level of capability that a manufacturer possesses when he has demonstrated that he has met those requirements. |
| CBGA/CCGA Meaning in Electronics | Ceramic Ball Grid Array/Ceramic Column Grid Array | A grid array packaged component that has ceramic as the substrate of the package and may have either solder balls or solder columns for connections. |
| CDS Meaning in Manufacturing | Customer Detail Specification | A document that describes the requirements of a desired system from the customer’s or user’s point of view. |
| CEM Meaning in Manufacturing | Contract Electronics Manufacturing | Production of electronic equipment on behalf of an original equipment manufacturer (OEM) customer, in which the design and brand name belongs to the OEM. |
| CFT Meaning in Manufacturing | Customer Focus Team | A team dedicated to the customer under the leadership of a program manager. |
| CNC Meaning in Manufacturing | Computer Numerical Control | Automated control of machining tools and 3D printers using a computer. |
| COB Meaning in Manufacturing | Chip On Board | Manufacturing process where integrated circuits are wired and bonded directly to a printed circuit board. |
| CP Meaning in Manufacturing | Capability Performance Index | The ratio of the measured performance of a process compared to specified limits. |
| CSP Meaning in Electronics | Chip Scale Package | A chip scale package is a type of integrated circuit package. |
| CTB Meaning in Electronics | Capability Test Board | A printed board specially designed to act as a capability-qualifying component (CQC) or to be used by the manufacturer to evaluate process variation, process control, or continuous improvement procedures. |
| CTE Meaning in Manufacturing | Coefficient of Thermal Expansion | This describes how the size of an object changes with a change in temperature. |
| CTO Meaning in Manufacturing | Configure-to-Order Systems Assembly | Hybrid of make to stock and make to order operations. |
| CTP Meaning in Manufacturing | Composite Test Pattern | A grouping of individual test patterns into specific arrangements, to reflect control and precision capability of a manufacturer or manufacturing process. |
| CTS Meaning in Electronics | Capability Test Segment | A segment or portion of a capability test board (CTB), containing a set or group of individual test patterns (ITP), intended to be used to demonstrate a specific level of printed board complexity or manufacturing capability. |
| CUSUM CHART | Cumulative Sum Control Chart | Control chart used to monitor small shifts in the process mean. It uses the cumulative sum of deviations from a target. |
| CAPA Meaning in Manufacturing | Corrective and Preventative Action | Improvements in processes to eliminate causes of non-conformities or other undesirable situations. |
D
| Acronyms | Meaning | Explanation |
| DFM Meaning in Manufacturing | Design for Manufacturing | The general engineering practice of designing products in a way that is easy to manufacture |
| DFX Meaning in Manufacturing | Design For X | The value-added service of instituting “best practices” in the design and new product introduction stages to improve X, where X is manufacturability, testability, mechanical assembly, serviceability, etc |
| DIM Meaning in Manufacturing | Data Information Module | A group of records that contain related data describing specific functions or tasks. |
| DIP Meaning in Electronics | Dual In-Line Package | It’s an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins |
| DNC Meaning in Manufacturing | Distributed Numerical Control | A network that links computer programs or computer-aided systems to numerically controlled machine tools. |
| DOA Meaning in Manufacturing | Date of Arrival | Usually refers to the date when components will arrive. |
| DP Meaning in Electronics | Delivered Panel | A production or prototype panel, or portion of either, intended to contain one or more printed boards in a specific arrangement or cluster, to facilitate economic assembly and testing. |
| DRAM Meaning in Electronics | Dynamic RAM | It’s a type of random-access semiconductor memory that stores each bit of data in a memory cell consisting of a tiny capacitor and a transistor, both typically based on metal-oxide-semiconductor technology. |
| DUT Meaning in Manufacturing | Device Under Test | It’s a manufactured product undergoing testing, either at first manufacture or later during its life cycle as part of ongoing functional testing and calibration checks. |
| DS Meaning in Manufacturing | Detailed Specification | A document that describes the exact requirements for a specific product, material, or service. |
| DVT Meaning in Manufacturing | Design Validation Test | Test to assure a product meets all of its design specifications |
| DFMA Meaning in Manufacturing | Design for Manufacture and Assembly | This is the combination of two methodologies; Design for Manufacture, and Design for Assembly. |
E
| 5 | Meaning | Explanation |
| ECO Meaning in Manufacturing | Engineering Change Order | Documentation that outlines the proposed change, lists the product or part(s) that would be affected and requests review and approval from the individuals who would be impacted or charged with implementing the change. |
| EDI Meaning in Electronics | Electronic Data Interchange | Businesses electronically communicating information that was traditionally communicated on paper, such as purchase orders and invoices. |
| EMI Meaning in Electronics | Electromagnetic Interference | A disturbance generated by an external source that affects an electrical circuit. |
| EOL Meaning in Electronics | End Of Life | Term applied to products or components that are being retired from the market because of technology obsolescence or rapidly declining demand. |
| ERP Meaning in Manufacturing | Enterprise Resource Planning | Integrated management of main business processes, often in real-time and mediated by software and technology. |
| ERS Meaning in Electronics | Equivalent Series Resistance | The equivalent series resistance of a capacitor is the internal resistance that appears in series with the capacitance of the device. |
| ESD Meaning in Electronics | Electrostatic Discharge | Electrostatic discharge is the sudden flow of electricity between two electrically charged objects caused by contact, an electrical short, or dielectric breakdown |
| ESS Meaning in Manufacturing | Environmental Stress Screening | A process that applies specific kinds of environmental stresses to products on an accelerated basis, but within their design parameters and limits. |
| EVT Meaning in Manufacturing | Engineering Validation Test | A test meant to identify design problems and solving them as early in the design cycle as possible. |
| EMS Meaning in Electronics | Electronics Manufacturing Service | A term used for companies that design, manufacture, test, distribute, and provide return/repair services for electronic components and assemblies for original equipment manufacturers. |
| ETL Certification Meaning in Electronics | Edison Testing Laboratories Certification | An equipment safety certification program operated by the laboratory, Intertek. |
F
| Acronyms | Meaning | Explanation |
| FA & T Meaning in Manufacturing | Final Assembly and Test | The process comprising a subset of all these manufacturing steps: fabricating and assembling the mechanical components and subassemblies of the final product, assembling one or more printed-circuit board (PCB) assemblies and other components into a subassembly, integrating all PCB assemblies and subassemblies into a finished product, testing, and preparing for shipping. |
| FAE Meaning in Manufacturing | Field Application Engineer | Technical support engineers for salesmen and marketing at technology companies. |
| FEA Meaning in Electronics | Finite-Element Analysis | A computer-based analysis method that subdivides geometric entities into smaller elements and links a series of equations to each element so that they can then be analyzed simultaneously. |
| FEM Meaning in Electronics | Finite-Element Modeling | The use of a model to represent a problem that can be evaluated by finite-element analysis. |
| FP Meaning in Electronics | Flat Pack | A low-profile IC package, which typically has gull-wing type of leads on two or four sides. |
| FPT Meaning in Electronics | Fine-Pitch Technology | A surface-mount assembly technology with component terminations on less than 0.625-mm (0.025-inch) centers. |
| FW Meaning in Electronics | Firmware | Firmware is a specific class of computer software that provides the low-level control for the device’s specific hardware. |
| FMEA Meaning in Electronics | Failure Modes and Effects Analysis | A method for evaluating a process to identify where and how it might fail and to assess the relative impact of different failures to identify the parts of the process that are most in need of change. |
| FCC Certification Meaning in Electronics | Federal Communications Commission Certification | A certification mark employed on electronic products manufactured or sold in the United States which certifies that the electromagnetic interference from the device is under limits approved by the Federal Communications Commission |
| FCT Meaning in Electronics | Final Circuit Test | A test that verifies the resistance, capacitance, and other component values which will determine if the PCB assembly was properly done. |
| FOB Meaning in Manufacturing | Free on Board | Shipping term used in retail to indicate who is responsible for paying transportation charges |
G
| Acronyms | Meaning | Explanation |
| GS Meaning in Manufacturing | Generic Specification | A document that describes as many general requirements as possible pertaining to a set, family, or group of products, materials, or service. |
H
| Acronyms | Meaning | Explanation |
| HASL Meaning in Electronics | Hot Air Solder Leveling | A type of finish used on printed circuit boards. The PCB is typically dipped into a bath of molten solder so that all exposed copper surfaces are covered by solder. |
| HDI Meaning in Electronics | High-Density Interconnect | Multi-layer PCB constructed with conductive micro via connections. |
| HLBD Meaning in Electronics | High-Level Block Diagram | A diagram of a system in which the principal parts or functions are represented by blocks connected by lines that show the relationships of the blocks. |
I
| Acronyms | Meaning | Explanation |
| IC Meaning in Electronics | Integrated Circuit | Set of electronic circuits on one small flat piece of semiconductor material that is normally silicon |
| ICT Meaning in Electronics | In-Circuit Test | Combination of hardware and software that identifies manufacturing induced faults of printed circuit board assemblies (PCBAs) by isolating and individually testing devices using a bed-of-nails fixture. |
| ID Meaning in Manufacturing | Industrial Design | Process of design applied to products that are to be manufactured through techniques of mass production. |
| ILB Meaning in Electronics | Inner-Lead Bond | The connection between a conductor on a bonding tape and a bare die |
| IMB Meaning in Electronics | Intermetallic Bond | Thin layer of chemical bonding in metals. |
| IMC Meaning in Electronics | Intermetallic Compound | Metallic compounds that form at the interfaces between different metals, such as copper-tin compounds that form at the interface of a solder joint and a copper lead. |
| IQC Meaning in Manufacturing | Incoming Quality Control/Check | The process used to validate the quality of a supplied lot of parts or components |
| IR Meaning in Manufacturing | Infrared Reflow | Re-melting of solder using infrared heating as the primary source of energy. |
| ITP Meaning in Manufacturing | Individual Test Pattern | A single test pattern designed and intended to serve a specific evaluation technique for determining an aspect of a manufacturer or manufacturing process capability. |
| ITS Meaning in Manufacturing | Individual Test Specimen | A single test specimen that contains an individual test pattern (ITP) and is used to determine an aspect of a manufacturer or manufacturing process capability. |
| ITT Meaning in Manufacturing | Inter-Test Time | The duration between two successive driver strobes. |
| IOT Meaning in Electronics | Internet Of Things | A system of interrelated computing devices that are provided with unique identifiers and the ability to transfer data over a network without requiring human-to-human or human-to-computer interaction. |
J
| Acronyms | Meaning | Explanation |
| JEDEC Meaning in Electronics | Joint Electronic Devices Engineering Council | Independent semiconductor engineering trade organization and standardization body. |
| JIT Meaning in Manufacturing | Just-In-Time | A methodology aimed primarily at reducing times within the production system as well as response times from suppliers and to customers. |
K
| Acronyms | Meaning | Explanation |
| KGA Meaning in Electronics | Known Good Assembly | A correctly operating printed board assembly that serves as a standard unit by which others can be compared. |
| KGB Meaning in Electronics | Known Good Board | A correctly operating PCB. It is used in learning or debugging a test program in development and for comparison testers where it serves as the standard unit by which other PCBs are compared. |
L
| Acronyms | Meaning | Explanation |
| LCC Meaning in Electronics | Leadless Ceramic Chip Carrier | A hermetically sealed ceramic package that has pads around its sides for solder connection in a surface mounting application. |
| LMC Meaning in Manufacturing | Least Material Condition | A feature of size symbol that describes a dimensional or size condition where the least amount of material (volume/size) exists within its dimensional tolerance. |
| LPI Meaning in Manufacturing | Liquid Photo-Imageable Solder Mask | An ink that is developed off using photographic imaging techniques to control deposition. |
| LSI Meaning in Electronics | Large-Scale Integration | The process of creating an integrated circuit by combining millions of MOS transistors onto a single chip. |
| LT Meaning in Manufacturing | Lead Time | The latency between the initiation and completion of a process. |
| LORA Meaning in Electronics | Low Range | A low-power wide-area network technology. |
M
| Acronyms | Meaning | Explanation |
| MCM Meaning in Electronics | Multichip Module | An electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use, it can be treated as if it were a larger IC. |
| MELF Meaning in Electronics | Metal Electrode Face Bonding | A cylindrical leadless component with a round body and metals terminals on the ends. |
| MES Meaning in Manufacturing | Manufacturing Execution System | Software systems designed to integrate with enterprise systems to enhance the shop-floor-control functionality that is usually inadequate in ERP systems |
| MMC Meaning in Manufacturing | Maximum Material Condition | Refers to a feature-of-size that contains the greatest amount of material, yet remains within its tolerance zone |
| MOQ Meaning in Manufacturing | Minimum Order Quantity | The lowest set amount of stock that a supplier is willing to sell |
| MP Meaning in Manufacturing | Mass Production | The production of large amounts of standardized products, including and especially on assembly lines |
| MRP Meaning in Manufacturing | Materials Requirement Planning | It’s a production planning, scheduling, and inventory control system used to manage manufacturing processes. |
| MTBF Meaning in Manufacturing | Mean Time Between Failures | The predicted elapsed time between inherent failures of a mechanical or electronic system, during normal system operation. |
| MAR Meaning in Manufacturing | Materials at Risk | |
| MCU Meaning in Electronics | Microcontroller Units | A small computer on a single metal oxide semiconductor. |
| MPQ Meaning in Manufacturing | Minimum Purchase Quantity | The lowest set amount of stock that a supplier is willing to sell. |
| MVP Meaning in Manufacturing | Minimum Viable Product | A version of a product with just enough features to satisfy early customers and provide feedback for future product development. |
N
| Acronyms | Meaning | Explanation |
| NC Meaning in Electronics | Numerical Control | The use of mathematics to define, design or test geometric quantities that are used in a computer-aided technology. |
| NC DRILL Meaning in Electronics | Numeric Control Drill Machine | A machine used to drill the holes in a printed board at exact locations, which are specified in a data file. |
| NMR Meaning in Electronics | Normal-Mode Rejection | The amount of noise superimposed on the input signal of a direct-current (DC) digital voltmeter that the instrument is capable of rejecting. |
| NPI Meaning in Manufacturing | New Product Introduction | The process that takes an idea from an initial working prototype to a thoroughly refined and reproducible final product. |
| NRE Meaning in Manufacturing | Non-recurring Engineering | Refers to the one-time cost to research, design, develop and test a new product or product enhancement. |
O
| Acronyms | Meaning | Explanation |
| OA Meaning in Manufacturing | Organic Aqueous | Water soluble flux. |
| OEM Meaning in Manufacturing | Original Equipment Manufacturer | An original equipment manufacturer (OEM) traditionally is defined as a company whose goods are used as components in the products of another company, which then sells the finished item to users. |
| OLB Meaning in Electronics | Outer-Lead Bond | The connection between a conductor on a bonding tape and the base material. |
| OoFF Meaning in Manufacturing | Out of Form actor | A prototype which has different dimensions, usually larger, than the final product. |
| OQC Meaning in Manufacturing | Outgoing Quality Control/Check | Refers to the inspection of the product to ensure that shipped products meet customer’s quality requirements before shipment. |
| OSP Meaning in Electronics | Organic Solder Preservative | A method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering. |
| ODM Meaning in Manufacturing | Original Design Manufacturer | A company that designs and manufactures a product, as specified, that is eventually rebranded by another firm for sale. |
| OTS Meaning in Manufacturing | Off The Shelf | Already existing components you can grab and use. |
P
| Acronyms | Meaning | Explanation |
| PBGA Meaning in Electronics | Plastic Ball Grid Array | A ball grid array component whose package substrate is made of plastic |
| PCA Meaning in Electronics | Printed Circuit Assembly | A PCB full with electronic components is called a printed circuit assembly |
| PCB Meaning in Electronics | Printed Circuit Board | The board on which electronic components are placed, often green, for example the motherboard in a PC. |
| PCBA Meaning in Electronics | Printed Circuit Board Assembly | Second-level integration of active and passive devices (electrical, electronic, optical and/or mechanical) on a rigid substrate. |
| PGA Meaning in Electronics | Pin Grid Array | A type of integrated circuit packaging. |
| PLCC Meaning in Electronics | Plastic Leaded Chip Carrier | Four-sided plastic package that has “J” leads around its periphery. |
| PN Meaning in Manufacturing | Part Number | Number used to identify an (electronic) component. |
| PO Meaning in Manufacturing | Purchase Order | The official document issued when a company buys something from another company. |
| PoC Meaning in Electronics | Proof of concept | The realization of an electronic product to demonstrate its feasibility. |
| PoV Meaning in Electronics | Point of view | Opinion |
| PP Meaning in Electronics | Production Panel | An arrangement of printed boards fabricated from laminate or base materials as a group in a specific cluster to facilitate economic fabrication techniques. |
| PQFP Meaning in Electronics | Plastic Quad Flat Pack | An FP with leads on four sides generally refers to a plastic quad flat package that is built to JEDEC standards. |
| PRD Meaning in Manufacturing | Product Requirements Document | A document containing all the requirements to a certain product. |
| PTH Meaning in Electronics | Pin-Through-Hole or Plated-Through-Hole | A method of soldering between components and PCB using component’s leads (or pins) inserted in PCB’s through-holes. |
| PWA Meaning in Electronics | Printed Wiring Assembly | The generic term for a PWB after all electrical components have been attached. |
| PWB Meaning in Electronics | Printed Wiring Board | The substrate; generally epoxy glass used to provide component attachment lands and interconnections to form a functioning electronic circuit. |
| PIC32 Meaning in Electronics | Peripheral Interface Controller | A family of specialized microcontroller chips produced by Microchip Technology. |
| PVT Meaning in Manufacturing | Production Validation Test | The first official production run, where teams verify that the product can be made at the volumes needed for the target cost. |
Q
| Acronyms | Meaning | Explanation |
| QFP Meaning in Electronics | Quad Flat Pack | Surface-mounted circuit package with “gull-wing” leads extending from each of the four sides. |
| QSOP Meaning in Electronics | Quarter-Size Small Outline Package | An SO style IC package that has leads on a 25-mil pitch. |
| QFD Meaning in Manufacturing | Quality Function Deployment | A method to help transform the voice of the customer into engineering characteristics for a product. |
R
| Acronyms | Meaning | Explanation |
| RAM Meaning in Electronics | Random Access Memory | Computer memory that can be read and changed in any order typically used to store working data and machine code. |
| RFQ Meaning in Manufacturing | Request For Quote | Business process in which a company or public entity requests a quote from a supplier for the purchase of specific products or services. |
| RMF Meaning in Manufacturing | Risk Management Factor | The maximum tolerable percentage of possible defects within a lot of units, based on approximately 95% confidence level. |
| ROM Meaning in Electronics | Read Only Memory | Non-volatile memory used in computers and other electronic devices. |
| RTOS Meaning in Electronics | Real Time Operating System | A real-time operating system is an operating system intended to serve real-time applications that process data as it comes in. |
| RMA Meaning in Manufacturing | Return Merchandise Authorization | Part of the process of returning a product to receive a refund, replacement, or repair during the product’s warranty period |
| RFX Meaning in Manufacturing | Request for X | |
| ROHS Meaning in Manufacturing | Restriction of Hazardous Substances | A directive that restricts the use of six hazardous materials in the manufacture of various types of electronic and electrical equipment. The materials are lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (CrVI), polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE), and four different phthalates (DEHP, BBP, BBP, DIBP) |
S
| Acronyms | Meaning | Explanation |
| SA & T Meaning in Manufacturing | Systems Assembly and Test | Process comprising a subset of all these manufacturing steps: fabricating and assembling the mechanical components and subassemblies of the final product, assembling one or more printed-circuit board (PCB) assemblies and other components into a subassembly, integrating all PCB assemblies and subassemblies into a finished product, testing, and preparing for shipping. |
| SIG Meaning in Manufacturing | Sigma | The lowercase Greek letter that is used to designate a standard deviation of a population. |
| SIP Meaning in Electronics | Single-Inline Package | A computer chip package that contains only a single row of connection pins. |
| SIR Meaning in Electronics | Surface Insulation Resistance | The electrical resistance of an insulating material between a pair of contacts, conductors, or grounding devices that is determined under specified environmental and electrical conditions. |
| SMA Meaning in Electronics | Surface Mount Assembly | A method for producing electronic circuits in which the components are mounted or placed directly onto the surface of a PCB. |
| SMC Meaning in Electronics | Surface Mount Component | A leadless device (part) that is capable of being attached to a printed board by surface mounting. |
| SMOBC Meaning in Electronics | Solder Mask Over Bare Copper | A method of fabricating a printed circuit board that results in final metallization being copper with no protective metal. |
| SMT Meaning in Electronics | Surface Mount Technology | Attaching electrical components directly to a board substrate rather than through a plated hole. |
| SN Meaning in Manufacturing. | Serial Number | A unique identifier assigned incrementally or sequentially to an item, to uniquely identify it. |
| SO Meaning in Electronics | Small Outline | A package resembling a flat pack with leads on only two sides. |
| SOIC Meaning in Electronics | Small Outline Integrated Circuit | Surface-mounted integrated circuit package which occupies an area about 30–50% less than an equivalent dual in-line package, with a typical thickness being 70% less. |
| SOP Meaning in Manufacturing | Standard Operating Procedure | Set of step-by-step instructions compiled by an organization to help workers carry out complex routine operations |
| SOP Meaning in Electronics | Small Outline Package | A type of surface mount IC package. They are very low-profile and have tight lead spacing. |
| SOT Meaning in Electronics | Small Outline Transistor | Family of small footprint, discrete surface mount transistor commonly used in consumer electronics. |
| SoW Meaning in Manufacturing | Statement of work | Document routinely employed in the field of project management. |
| SPC Meaning in Manufacturing | Statistical Process Control | The use of statistical techniques to analyze a process or its output to determine any variation from a benchmark and to take appropriate action to restore statistical control. |
| SQC Meaning in Manufacturing | Statistical Quality Control | Refers to the use of statistical methods in the monitoring and maintaining of the quality of products and services. |
| SS Meaning in Manufacturing | Sectional Specification | A document that describes the specific requirements pertaining to a portion of a set, family, or group of products, materials or, services. |
| STM32 Meaning in Electronics | STMicroelectronics | Family of 32-bit microcontroller integrated circuits by STMicroelectronics |
| SMD Meaning in Electronics | Surface Mount Device | A product made using SMT technology. |
| SPC Meaning in Manufacturing | Statistical Process Control | Quality control shceme that employs statistical methods to monitor and control a process. |
T
| Acronyms | Meaning | Explanation |
| TAB Meaning in Electronics | Tape Automated Bonding | Process that places bare integrated circuits onto a flexible printed circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide film, thus providing a means to directly connect to external circuits. |
| TBD Meaning in Electronics | To Be Determined | We will decide on this later |
| TBGA Meaning in Electronics | Tape Ball Grid Array | A ball grid array component package that uses TAB techniques to make the connections between the IC chip and the solder balls. |
| TCE Meaning in Electronics | Thermal Coefficient of Expansion | Describes how the size of an object changes with a change in temperature. |
| TG Meaning in Electronics | Glass Transition Temperature | The point at which rising temperatures cause resin inside the solid base laminate to start to exhibit soft, plastic-like symptoms. |
U
| Acronyms | Meaning | Explanation |
| UL Certification Meaning in Manufacturing | Underwriters Laboratories Certification | UL is a world leader in product safety testing and certification. |
V
| Acronyms | Meaning | Explanation |
| VFP Meaning in Electronics | Very Fine Pitch | The center-to-center lead distance of surface-mount packages that are between 0.012 inches and 0.020 inches. |
| VSOIC Meaning in Electronics | Very Small Outline IC | A SO style IC package that has leads with a pitch of 30 mils or less. |
W
| Acronyms | Meaning | Explanation |
| WIP Meaning in Manufacturing | Work in Process | Generally describes inventory that is currently being processed in an operation, or inventory that has been processed through one operation and is awaiting another operation. |
