Hot air solder leveling is a popular type of finish for printed circuit boards (PCBs).
In practice is a solder mask ( think of the green material that covers a PCB) composed of
- 63% tin
- 37% lead
The way to apply this solder mask (hot air solder leveling) on a PCB is by dipping the PCB into a pot of molten tin/lead alloy.
Then a hot air leveling removes the excess of alloy.
Table of Contents
ADVANTAGES OF HOT AIR SOLDER LEVELING
- Low cost
- Widely available
- Provides reliable solder joints
- Excellent shelf life
- Easy to re-work
DISADVANTAGES OF HOT AIR SOLDER LEVELING
- Uneven surface
- Not suitable for fine pitch components
- Not suitable plated through-hole
- Poor wetting
CONTINUE READING HOT AIR SOLDER LEVELING
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